Forming rigid circuit board

Metal working – Method of mechanical manufacture – Electrical device making

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156322, H05K 336

Patent

active

056552912

ABSTRACT:
A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.

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