Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1997-08-08
2000-02-01
Gulakowski, Randy
Etching a substrate: processes
Forming or treating thermal ink jet article
438 21, B41J 2135
Patent
active
060199075
ABSTRACT:
A refill channel for multiple rows of nozzles is formed in a silicon die by thinning the die in the vicinity of the rows, then etching respective trenches within the thinned portion of the die. Monolithic architectures including such trenches are achieved for existing inkjet nozzle geometries having close row spacing.
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Gulakowski Randy
Hewlett--Packard Company
Olsen Allan
LandOfFree
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