Forming press for semiconductor package leads

Details Forming press for semiconductor package leads Forming press for semiconductor package leads

1990-04-30

1991-07-02

Spruill, Robert L.

Wireworking

Crimping

B21F 100

Patent

active

050278665

ABSTRACT:
A forming press for leads of semiconductor packages comprises a package supporting die and a punch. The punch comprises a package securing component movable along a first line of movement, for temporarily securing the package to the die, and a pair of lead bending components, movable, relative to the package securing component, along oblique lines of movement which converge toward the line of movement of the package securing component. The punch assembly includes a holder which supports the package securing component while allowing a limited amount of relative movement. The lead bending components are supported by the package securing component and guided in slots formed in the package securing component. Movement of the lead bending components is effected by rollers on the holder which roll on smooth surfaces at the upper ends of the lead bending components as they push downward thereon, thereby allowing the lead bending components to move in oblique paths as the holder moves in the downward direction.

REFERENCES:
patent: 3986533 (1976-10-01), Woodman, Jr.
patent: 4515001 (1985-05-01), Zahn

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