Forming plated through holes in a printed circuit board by using

Details Forming plated through holes in a printed circuit board by using Forming plated through holes in a printed circuit board by using

1986-11-10

1989-04-18

Lall, Parshotam S.

Boots, shoes, and leggings

156901, 1566591, G05C 902

Patent

active

048232777

ABSTRACT:
Plated through holes in a printed circuit board can be conveniently produced during manufacture of the circuit board under the control of a computer controlled plotter by the use of a pen-like instrument which positively displaces a thick film fluid conductive adhesive on a tip of the instrument. The fluid is smeared onto the side walls of the hole by moving the tip in a peripheral motion around the side wall of the hole. Copper is electroplated directly onto the conductive adhesive. Resist material is applied in a similar fashion prior to etching the circuit traces on the surface sheets of the circuit board.

REFERENCES:
patent: 3961599 (1976-06-01), Jones, Jr.
patent: 4400708 (1983-08-01), Sachs
patent: 4485387 (1984-11-01), Drumheller
patent: 4588468 (1986-05-01), McGinty et al.
patent: 4610756 (1986-09-01), Strobel
patent: 4692351 (1987-09-01), Maeda et al.

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