Forming patterns in metallic or ceramic substrates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156230, 1562722, 430256, 430260, 430271, 430311, C04B 3700

Patent

active

045552851

ABSTRACT:
A method for forming a pattern in a metallic and/or ceramic substrate by laminating together the substrate which is in the green stage and a composite of a photosensitive material and a backing wherein the photosensitive material has been developed into the desired pattern, and then subjecting the substrate to elevated temperatures in order to cause sintering of the substrate and removal of the photosensitive material, thereby resulting in embedding of the pattern into the sintered substrate.

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patent: 3526504 (1970-09-01), Celeste
patent: 3614834 (1971-10-01), Chance et al.
patent: 3615980 (1971-10-01), Schuck
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3984244 (1976-10-01), Collier et al.
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4234673 (1980-11-01), Scrutton et al.
patent: 4353957 (1982-10-01), Rutt et al.
patent: 4405394 (1983-09-01), Cohen

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