Forming of thick-layer, hybrid electronic printed circuits

Details Forming of thick-layer, hybrid electronic printed circuits Forming of thick-layer, hybrid electronic printed circuits

1982-11-12

1985-05-14

Kittle, John E.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427101, 427102, 427103, 4271263, B05D 512

Patent

active

045172277

ABSTRACT:
Thick-layer hybrid electronic printed circuits are formed by printing predetermined circuit pattern onto an insulating substrate by deposition of predetermined ink pattern thereupon, advantageously by silk-screening or masking, and then baking said ink circuit pattern, and repeating the deposition/baking steps as required, the subject forming process featuring use of an insulating ink comprising a non-conductive metallic oxide extender, desirably cuprous oxide, which ink is thus either potentially conductive or potentially resistive, and the development of such conductivity or resistivity, after baking, by treating the ink pattern with a reducing agent, desirably a borohydride, as to readily and quantitatively convert said metal oxide into a conducting metal.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble
patent: 4294009 (1981-10-01), Quintin
patent: 4322316 (1982-03-01), Provance

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