Forming method of contact hole and manufacturing method of...

Semiconductor device manufacturing: process – Having organic semiconductive component

Reexamination Certificate

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C438S637000, C438S672000

Reexamination Certificate

active

07655499

ABSTRACT:
When forming a contact hole by a conventional manufacturing step of a semiconductor device, a resist is required to be formed on almost entire surface of a substrate so as to be applied on a film other than an area in which a contact hole is to be formed, leading to drastically reduced throughput. According to a forming method of a contact hole and a manufacturing method of a semiconductor device, an EL display device and a liquid crystal display device of the invention, an island shape organic film is selectively formed over a semiconductor layer, a conductive layer or an insulating layer, and an insulating film is formed around the island shape organic film to form a contact hole. Therefore, a conventional patterning using a resist is not required, and high throughput and low cost can be achieved.

REFERENCES:
patent: 5247375 (1993-09-01), Mochizuki et al.
patent: 5483082 (1996-01-01), Takizawa et al.
patent: 5580796 (1996-12-01), Takizawa et al.
patent: 5610414 (1997-03-01), Yoneda et al.
patent: 5908721 (1999-06-01), Emoto et al.
patent: 6429400 (2002-08-01), Sawada et al.
patent: 6660545 (2003-12-01), Furusawa
patent: 6715871 (2004-04-01), Hashimoto et al.
patent: 7138304 (2006-11-01), Hirai
patent: 7399704 (2008-07-01), Fujii et al.
patent: 7510905 (2009-03-01), Fujii et al.
patent: 2002/0014470 (2002-02-01), Okada et al.
patent: 2002/0046681 (2002-04-01), Hirose
patent: 2002/0046682 (2002-04-01), Fan et al.
patent: 2002/0128515 (2002-09-01), Ishida et al.
patent: 2002/0151171 (2002-10-01), Furusawa
patent: 2002/0182890 (2002-12-01), Ishida et al.
patent: 2003/0030689 (2003-02-01), Hashimoto et al.
patent: 2003/0054653 (2003-03-01), Yamazaki et al.
patent: 2003/0059975 (2003-03-01), Sirringhaus et al.
patent: 2003/0059984 (2003-03-01), Sirringhaus et al.
patent: 2003/0059987 (2003-03-01), Sirringhaus et al.
patent: 2003/0060038 (2003-03-01), Sirringhaus et al.
patent: 2003/0148401 (2003-08-01), Agrawal et al.
patent: 2004/0050685 (2004-03-01), Yara et al.
patent: 2004/0075396 (2004-04-01), Okumura et al.
patent: 2005/0001967 (2005-01-01), Chae et al.
patent: 2005/0005799 (2005-01-01), Hirai
patent: 2005/0007398 (2005-01-01), Hirai
patent: 2005/0025880 (2005-02-01), Masuda
patent: 2005/0043186 (2005-02-01), Maekawa et al.
patent: 2005/0051770 (2005-03-01), Ando et al.
patent: 2005/0074963 (2005-04-01), Fujii et al.
patent: 2005/0158665 (2005-07-01), Maekawa et al.
patent: 2005/0170565 (2005-08-01), Fujii et al.
patent: 2007/0026580 (2007-02-01), Fujii
patent: 2007/0126955 (2007-06-01), Hosoya
patent: 1340838 (2003-09-01), None
patent: 06-202153 (1994-07-01), None
patent: 07-024579 (1995-01-01), None
patent: 09-320363 (1997-12-01), None
patent: 11-326951 (1999-11-01), None
patent: 11-340129 (1999-12-01), None
patent: 2000-035511 (2000-02-01), None
patent: 2000-039213 (2000-02-01), None
patent: 2000-068233 (2000-03-01), None
patent: 2000-089213 (2000-03-01), None
patent: 2001-068827 (2001-03-01), None
patent: 2001-093871 (2001-04-01), None
patent: 2001-179167 (2001-07-01), None
patent: 2002-066391 (2002-03-01), None
patent: 2002-151478 (2002-05-01), None
patent: 2002-151524 (2002-05-01), None
patent: 2002-237463 (2002-08-01), None
patent: 2002-237480 (2002-08-01), None
patent: 2002-289864 (2002-10-01), None
patent: 2002-324966 (2002-11-01), None
patent: 2002-359246 (2002-12-01), None
patent: 2002-359347 (2002-12-01), None
patent: 2003-017413 (2003-01-01), None
patent: 2003-080694 (2003-03-01), None
patent: 2003-197531 (2003-07-01), None
patent: 2003-311197 (2003-11-01), None
patent: 2003-347284 (2003-12-01), None
patent: WO 01/11426 (2001-02-01), None
patent: WO 01/47044 (2001-06-01), None
patent: WO 02/40742 (2002-05-01), None
patent: WO-2004/070809 (2004-08-01), None
patent: WO-2004/070810 (2004-08-01), None
patent: WO-2004/070811 (2004-08-01), None
patent: WO 2004/070819 (2004-08-01), None
patent: WO-2004/070820 (2004-08-01), None
patent: WO-2004/070821 (2004-08-01), None
patent: WO-2004/070822 (2004-08-01), None
patent: WO 2004/070823 (2004-08-01), None
patent: WO 2005/022262 (2005-03-01), None
Tsutsui.T et al., “Electroluminescence in Organic Thin Films,”, Photochemical Processes in Organized Molecular Systems, 1991, pp. 437-450.
Baldo.M et al., “Highly Efficient Phosphorescent Emission From Organic Electroluminescent Devices,”, Nature, Sep. 10, 1998, vol. 395, pp. 151-154.
Baldo.M et al., “Very High-Efficiency Green Organic Light-Emitting Devices Based on Electrophosphorescence,”, Appl. Phys. Lett. (Applied Physics Letters) , Jul. 5, 1999, vol. 75, No. 1, pp. 4-6.
Tsutsui.T et al., “High Quantum Efficiency in Organic Light-Emitting Devices With Iridium-Complex as a Triplet Emissive Center,”, Jpn. J. Appl. Phys.(Japanese Journal of Applied Physics) , Dec. 15, 1999, vol. 38/Part.2, No. 12B, pp. L1502-L1504.

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