Forming isolation and device regions due to enhanced diffusion o

Metal treatment – Compositions – Heat treating

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148187, 148188, 219121L, 357 91, 427 53, B23K 2700, H01L 21268

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active

041371003

ABSTRACT:
An array of blind holes are formed in a silicon wafer with a laser and a dopant deposited therein. The wafer is then placed in a furnace for a time and at a temperature sufficient to drive the dopant into the wafer to a predetermined depth.
Alternatively, the material may be applied to the wafer prior to the drilling of the blind holes and the dopant driven into the wafer as the holes are being formed.

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