Metal deforming – By tool-couple embodying nonplanar tool-face
Patent
1996-03-25
1998-10-13
Crane, Daniel C.
Metal deforming
By tool-couple embodying nonplanar tool-face
72414, 723796, 29846, B21D 3700
Patent
active
058195793
ABSTRACT:
A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a "dynamic pressure cushion" into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The "dynamic pressure cushion" is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the "dynamic pressure cushion" properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.
REFERENCES:
patent: 2427144 (1947-09-01), Jansen
patent: 2535674 (1950-12-01), Franklin
patent: 2638660 (1953-05-01), Van Gessel
patent: 2716268 (1955-08-01), Steigerwalt
patent: 2837619 (1958-06-01), Stein
patent: 2861911 (1958-11-01), Martin et al.
patent: 2912745 (1959-11-01), Steigerwalt et al.
patent: 2912746 (1959-11-01), Oshry et al.
patent: 2912748 (1959-11-01), Gray
patent: 3037265 (1962-06-01), Kollmeier
patent: 3147054 (1964-09-01), Alexander et al.
patent: 3148098 (1964-09-01), Beste, Jr.
patent: 3158421 (1964-11-01), Hasenauer, Jr.
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 3423260 (1969-01-01), Heath
patent: 3434208 (1969-03-01), Toomey et al.
patent: 3488890 (1970-01-01), Owens et al.
patent: 3523802 (1970-08-01), Spall
patent: 3612745 (1971-10-01), Warren
patent: 3875542 (1975-04-01), Holland
patent: 3889363 (1975-06-01), Davis
patent: 4020548 (1977-05-01), Pohl
patent: 4075420 (1978-02-01), Walton
patent: 4080027 (1978-03-01), Benasutti
patent: 4089734 (1978-05-01), Bierig
patent: 4091125 (1978-05-01), Delgadillo
patent: 4246563 (1981-01-01), Noerholm
patent: 4272753 (1981-06-01), Nicolay
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4325771 (1982-04-01), Brower
patent: 4357750 (1982-11-01), Ostman
patent: 4406062 (1983-09-01), Navarro
patent: 4528259 (1985-07-01), Sullivan
patent: 4532152 (1985-07-01), Elarde
patent: 4604799 (1986-08-01), Gurol
patent: 4651417 (1987-03-01), Schumacher, III
patent: 4655518 (1987-04-01), Johnson et al.
patent: 4721550 (1988-01-01), Schumacher, III
patent: 4775611 (1988-10-01), Sullivan
patent: 4840702 (1989-06-01), Schumacher, III
patent: 5088009 (1992-02-01), Harada et al.
patent: 5097101 (1992-03-01), Trobough
patent: 5161403 (1992-11-01), Kitchens
patent: 5184111 (1993-02-01), Pichl
patent: 5277052 (1994-01-01), Braunheim
Action News, Spring/Summer 1990, Action Technologies, Inc. "Molded Flexible Circuits".
IBM Technical Disclosure bulletin; vol. 9, No. 3; Aug. 19, 1966; pp. 236-237; D.G. Pittwood et al.
Crane Daniel C.
Research Organization for Circuit Knowledge
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