Metal treatment – Compositions – Heat treating
Patent
1978-01-18
1981-01-06
Rutledge, L. Dewayne
Metal treatment
Compositions
Heat treating
219121L, 357 20, 357 34, 357 91, H01L 2126
Patent
active
042434335
ABSTRACT:
A semiconductor integrated circuit structure in which the inset regions are ion implanted and laser annealed to maintain substantially the dimensions of the implantation and the method of forming inset implanted regions having controlled dimensions.
REFERENCES:
patent: 3925106 (1975-12-01), Ku et al.
patent: 4059461 (1977-11-01), Fan et al.
Kutukova et al., "Laser . . . Implanted Si" Sov. Phys. Semicond. 10 (1976) 265.
Shtyrkov et al., "Local Laser Annealing . . . Layers" Sov. Phys. Semicond. 9 (1976) 1309.
Antonenko et al., ". . . Impurity in Si . . . Laser Annealing" Sov. Phys. Semicond., 10 (1976) 81.
Bogatyrev et al., ". . . P-N Junctions . . . Laser Pulse . . . " Sov. Phys. Semicond. 10 (1976) 826.
Klimenko et al., ". . . Laser . . . Ion-Impln-Amorphized Si . . . " Sov. J. Quant. Electron., 5 (1976) 1289.
Kachurin et al., "Annealing . . . Laser . . . Pulses" Sov. Phys. Semicond., 9 (1976) 946.
Bhatia et al., "Isolation Process . . . " IBM-TDB, 19 (1977) 4171.
Poponiak et al., ". . . Implant Damage . . . Epi-Layer" IBM-TDB, 19 (1976) 2052.
Young et al., "Laser Annealing . . . Si" Appl. Phys. Letts. 32(3), 1978, 139.
Joshi et al., ". . . Impurity . . . S/C by Lasers" IBM-TDB, 11 (1968) 104.
Joshi et al., "Masking . . . for Laser Induced Diffusion" IBM-TDB, 13 (1970) 928.
Roy Upendra
Rutledge L. Dewayne
LandOfFree
Forming controlled inset regions by ion implantation and laser b does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Forming controlled inset regions by ion implantation and laser b, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Forming controlled inset regions by ion implantation and laser b will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-283172