Metal treatment – Compositions – Heat treating
Patent
1978-06-30
1979-04-24
Ozaki, G.
Metal treatment
Compositions
Heat treating
29571, 148187, 148188, H01L 2126, H01L 21225
Patent
active
041510100
ABSTRACT:
A method for forming adjacent impurity regions of differing conductivities in a semiconductor substrate without using lithography. N type impurities of a first conductivity are introduced into the substrate to form first impurity regions. The substrate is then oxidized to create a mask having a thickness which is greater over the N type impurity regions than over the remainder of the substrate. A portion of the masking layer is then removed, preferably by dip-etching, to a depth which is sufficient to re-expose the substrate only. Impurities of a second conductivity are then introduced in the substrate adjacent the N type impurity regions, with the remaining portion of the mask protecting the N type impurity regions from introduction of the second impurities therein.
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Galvin Thomas F.
International Business Machines - Corporation
Ozaki G.
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