Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-02-08
1987-01-13
Lowe, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
40316, 174DIG8, 156 86, 156198, 15624413, 156290, 1563063, 1563084, 156344, 428 36, B29C 5320, B32B 3102
Patent
active
046362711
ABSTRACT:
A tubular wire marker sleeve is disclosed. The sleeve includes a central portion which is flattened by ultrasonic welding to form a releasable bond and end extents which are unflattened facilitating insertion of an electrical wire into the sleeve. Plural sleeves may be assembled on a support card for printing on the sleeve with a conventional typewriter or computer printer.
REFERENCES:
patent: 2043070 (1936-06-01), Rutkowski
patent: 2058542 (1936-10-01), Wise
patent: 2161561 (1939-06-01), Dalton
patent: 3086242 (1963-04-01), Cook et al.
patent: 3212207 (1965-10-01), Searing
patent: 3226285 (1965-12-01), Iorenko
patent: 3468731 (1969-09-01), Obeda
patent: 3542618 (1970-11-01), DeVaughn
patent: 3894731 (1975-07-01), Evans
patent: 3985852 (1976-10-01), Evans
patent: 4032010 (1977-06-01), Evans
patent: 4087301 (1978-05-01), Steadman
patent: 4191405 (1980-03-01), Johnstun
patent: 4293364 (1981-10-01), Fujio
patent: 4361230 (1982-11-01), Downing
patent: 4363401 (1982-12-01), Savagian
patent: 4365400 (1982-12-01), Carlomagno
patent: 4425390 (1984-01-01), Changani et al.
patent: 4442939 (1984-04-01), Downing
patent: 4451965 (1984-06-01), Carlomagno
patent: 4461793 (1984-07-01), Blok et al.
Abbruzzese Salvatore J.
Lowe James
Rodrick Robert M.
Thomas & Betts Corporation
LandOfFree
Forming a wire marker sleeve does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Forming a wire marker sleeve, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Forming a wire marker sleeve will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2354230