Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2007-08-07
2007-08-07
Carrillo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S002000, C134S028000, C134S040000, C134S041000, C134S042000
Reexamination Certificate
active
10448127
ABSTRACT:
A composition for the cleaning of residues from substrates can contain from about 0.01 percent by weight to about 5 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an organic amide solvent and from 0 to about 50 weight percent of an organic sulfoxide solvent. The composition can have a pH between about 7 and about 10, alternately from greater than 8 to about 10. Additionally, the composition optionally can contain corrosion inhibitors, chelating agents, surfactants, acids, and/or bases. In use of the composition, a substrate can advantageously be contacted with the composition for a time and at a temperature that permits cleaning of the substrate.
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Carrillo Sharidan
EKC Technology, Inc.
Morgan & Lewis & Bockius, LLP
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