Forming a metallized layer on an AlN substrate by applying and h

Details Forming a metallized layer on an AlN substrate by applying and h Forming a metallized layer on an AlN substrate by applying and h

1993-11-02

1994-12-06

Beck, Shrive

Coating processes

With post-treatment of coating or coating material

Heating or drying

4273835, 4273977, B05D 302

Patent

active

053709071

ABSTRACT:
A metallized layer is to be formed on a surface of an aluminum nitride base material, which may be a sintered body or a nonsintered compact. A mixture is prepared from an oxide component consisting of at least one of Al.sub.2 O.sub.3, SiO.sub.2, CaO, and Y.sub.2 O.sub.3, an iron family component consisting of at least one of Fe, Co and Ni and high melting temperature metal consisting of W and Mo. The content of each component is within a specified range. A paste is prepared by adding an organic binder substance to the mixture. The paste is applied to the surface of the base material and heated under specified conditions to form a metallized layer having a high adhesive peel strength on the surface of the base material.

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patent: 4840853 (1989-06-01), Iio et al.
patent: 4965659 (1990-10-01), Sasamew et al.
Patent Abstracts of Japan No. 1-83586 (A); Kyocera Corp. Mar. 29, 1989.
Patent Abstracts of Japan No. 1-833587 (A); Kyocera Corp. Mar. 29, 1989.
Patent Abstracts of Japan No. 1-249681 (A); Sumitomo Electric Industries, Ltd. Apr. 10, 1989.

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