Inductor devices – With supporting and/or spacing means between coil and core – Preformed insulation between coil and core
Reexamination Certificate
2006-06-06
2006-06-06
Nguyen, Tuyen T (Department: 2832)
Inductor devices
With supporting and/or spacing means between coil and core
Preformed insulation between coil and core
C336S192000
Reexamination Certificate
active
07057487
ABSTRACT:
The invention relates to a former and a coil for printed circuit board assembly, consisting of a prismatic or cylindrical coil form for at least one coil and a foot part, which is configured as one piece with the coil form, at least sections of said part protruding externally above the coil form. According to the invention, connecting wires for the coil or coils are formed from the coil wire and their ends are configured as solder terminals, which are housed and held in wire guides of the foot part.
REFERENCES:
patent: 2941172 (1960-06-01), Sutton, Jr.
patent: 3169234 (1965-02-01), Renskers
patent: 3548356 (1970-12-01), Wright
patent: 3609616 (1971-09-01), Dumeige
patent: 3649939 (1972-03-01), Hildebrandt
patent: 4345231 (1982-08-01), Cline et al.
patent: 4484170 (1984-11-01), Wirth et al.
patent: 6842101 (2005-01-01), Maguire et al.
patent: 20 47 901 (1972-04-01), None
patent: 199 58 199 (2000-06-01), None
Rothmayer Thomas
Weinmeier Harald
Nguyen Tuyen T
Siemens Aktiengesellschaft
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