Formed substrate used for solid electrolytic capacitor,...

Compositions – Electrically conductive or emissive compositions

Reexamination Certificate

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Details

C252S518100, C252S511000, C361S523000, C361S528000, C361S529000, C361S525000, C029S025030, C428S210000, C427S080000

Reexamination Certificate

active

10479053

ABSTRACT:
A formed substrate, wherein the surface of the valve-acting metal having a dielectric film is at least partially covered with an oxide comprising Si, valve-acting metal element and oxygen, preferably, wherein the content of Si in the formed foil having an aluminum oxide dielectric film decreases continuously from the surface of the dielectric film toward the inner part in some regions in the aluminum dielectric film thickness; a method for producing the formed substrate; and a solid electrolytic capacitor comprising a solid electrolyte on the formed substrate. A solid electrolytic capacitor manufactured by using a formed substrate according to the present invention, improved in adhesion to an electrically conducting polymer (solid electrolyte) with its area coverage contacting the polymer being sufficiently large, is increased in the electrostatic capacitance among individual capacitors and improved in the LC yield as compared with capacitors otherwise manufactured.

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International Search Report for PCT/JP02/05785 dated Sep. 17, 2002.

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