Formation of trench isolation for active areas and first level c

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438129, 438427, 438420, H01L 2176

Patent

active

060636874

ABSTRACT:
A trench isolation structure for a semiconductor is provided including an isolation ring and an isolation path. The isolation ring surrounds active semiconductor areas and is bordered on the outside by inactive semiconductor area. The isolation path extends from the isolation ring through the inactive semiconductor area. A first level conductor on the isolation path electrically connects or capacitively couples a device in the active semiconductor area to a location on the substrate outside the isolation ring. The isolation path has a configuration derived from the layout of the conductor.

REFERENCES:
patent: 3840412 (1974-10-01), Davidsohn et al.
patent: 4374011 (1983-02-01), Vora et al.
patent: 4727048 (1988-02-01), Pierce et al.
patent: 4857141 (1989-08-01), Abe et al.
patent: 4916513 (1990-04-01), Li
patent: 5362669 (1994-11-01), Boyd et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Formation of trench isolation for active areas and first level c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of trench isolation for active areas and first level c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of trench isolation for active areas and first level c will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-258454

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.