Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Patent
1997-04-14
2000-05-16
Fourson, George
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
438129, 438427, 438420, H01L 2176
Patent
active
060636874
ABSTRACT:
A trench isolation structure for a semiconductor is provided including an isolation ring and an isolation path. The isolation ring surrounds active semiconductor areas and is bordered on the outside by inactive semiconductor area. The isolation path extends from the isolation ring through the inactive semiconductor area. A first level conductor on the isolation path electrically connects or capacitively couples a device in the active semiconductor area to a location on the substrate outside the isolation ring. The isolation path has a configuration derived from the layout of the conductor.
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Bracchitta John A.
Jaffe Mark D.
Lavin Mark Alan
Maynard Daniel Nelson
Sengle Edward W.
Fourson George
International Business Machines - Corporation
Leas James M.
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