Superconductor technology: apparatus – material – process – High temperature – per se – Having tc greater than or equal to 150 k
Patent
1988-07-06
1990-08-28
Niebling, John F.
Superconductor technology: apparatus, material, process
High temperature , per se
Having tc greater than or equal to 150 k
2041801, 2041821, 2041809, 505739, 505737, C25B 700
Patent
active
049525573
ABSTRACT:
A method for depositing superconducting ceramic materials on an article by electrodeposition including the steps of obtaining a dispersion of the components of a superconducting ceramic material in a non-aqueous medium and creating an electrical field within the medium such that the material will migrate to and deposit on an electrode placed within the medium. After deposition, the article is sintered and then reoxygenated to achieve the composition required for the superconducting ceramic material.
REFERENCES:
patent: Re32178 (1986-06-01), Yoshizaki
patent: 4108737 (1978-08-01), Ehrhardt
patent: 4810339 (1989-03-01), Heavens
Chu, C. W. et al., "Evidence for Superconductivity Above 40K in the La--Ba--Cu--O Compound System," Physical Review Letters, vol. 58, No. 4, (Jan. 26, 1987), pp. 405-407.
Wu, M. K. et al., "Superconductivity at 93K in a New Mixed-Phase Y--Ba--Cu--O Compounds System at Ambient Pressure," Physical Review Letters, vol. 58, No. 9, (Mar. 2, 1987), pp. 908-910.
Sun, J. Z. et al., "Superconductivity and Magnetism in the High-T.sub.c Superconductor Y--Ba--Cu--O," Physical Review Letters, vol. 58, No. 15, (Apr. 13, 1987), pp. 1574-1576.
Cava, R. J. et al., "Bulk Superconductivity at 91K in Single-Phase Oxygen-Deficient Perovskite Ba.sub.2 YCu.sub.3 O.sub.9 --," Physical Review Letters, vol. 58, No. 16, (Apr. 20, 1987), pp. 1676-1679.
Murphy, D. W. et al., "New Superconducting Cuprate Perovskites," Physical Review Letters, vol. 58, No. 18, (May 4, 1987), pp. 1888-90.
Wang, H. H. et al., "Comparison of Carbonate, Citrate, and Oxalate Chemical Routes to the High-T.sub.c Metal Oxide Superconductors La.sub.2-x Sr.sub.x CuO.sub.4," Inorganics Chemistry, vol. 26, No. 10, (May 20, 1987), pp. 1474-1476.
Ovshinsky, S. R. et al., "Superconductivity at 155K," Physical Review Letters, vol. 58, No. 24, (Jun. 15, 1987), pp. 2579-2581.
Davison, S. et al., "Chemical Problems Associated with the Preparation and Characterization of Superconducting Oxides Containing Copper," in: Nelson, D. L. et al., Chemistry of High-Temperature Superconductors (Wash., D.C., American Chemical Society, 1987), pp. 65, 70 and 71.
Poeppel, R. B. et al., "Fabrication of YBa.sub.2 Cu.sub.3 O.sub.7 Superconducting Ceramics," in: Nelson, D. L. et al., Chemistry of High-Temperautre Superconductors, (Wash. D.C., American Chemical Society, 1987), pp. 261-265.
The Application of Superconducting Ceramics as Substrates for the Electrochemical Deposition of Conducting Polymers and Metals by Kaneto et al., Japanese Journal of Applied Physics, vol. 26, No. 11, (1987).
Superconductivity and Magnetism in the High-Tc Superconductor Y--Ba--Cu--O by Sun et al., Physical Review Letters, vol. 58, No. 15, (1987).
Comparison of Carbonate, Citrate, and Oxalate Chemical Routes to the High Tc Metal Oxide Superconductors La.sub.2-x Sr.sub.x CUO.sub.4 by Wang et al., Inorganic Chemistry, vol. 26, (1987).
Preparation of (La.sub.1-x Sr.sub.x).sub.2 CUO.sub.4 Superconducting Films by Screen Printing Method by Koinuma et al., Japanese Journal of Applied Physics, Line 26, No. 4, (1987).
High T.sub.c Superconductivity in Screen Printed Yb--Ba--Cu--O Films by Koinuma et al., Japanese Journal of Applied Physics, vol. 26, No. 5, (1987).
Ametek Inc.
Niebling John F.
Rodriguez Isabelle
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