Formation of self-aligned contacts

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 40, 437 41, 437 51, 437228, 437235, 437245, H01L 23522

Patent

active

049578812

ABSTRACT:
A process for forming self-aligned metal-semiconductor contacts in a device comprising MISFET type structures essentially comprises conformably depositing a matrix metallic layer on the front of the wafer and the subsequent deposition of a planarization SOG layer. After having used a noncritical mask for defining the "length" of the selfaligned contacts to be formed, the SOG layer is etched until leaving a residue layer on the bottom of the valleys of the conformably deposited matrix metallic layer in areas between two adjacent gate lines of polysilicon. A selective etching of the matrix layer using said SOG residues as a mask, defines the contacts, self-aligned in respect to the opposite spacers of two adjacent polysilicon gate lines. An insulating dielectric layer is deposited and etched until exposing the peaks of the preformed contacts. Over such an advantageously planarized surface contacts on the polysilicon gate lines may be defined by a customary masking process and finally the second level metal is deposited.

REFERENCES:
patent: 4398335 (1983-08-01), Lehrer
patent: 4502210 (1985-03-01), Okuyama et al.
patent: 4505030 (1985-03-01), Jeuch
patent: 4545852 (1985-10-01), Barton
patent: 4662064 (1987-05-01), Hsu et al.
patent: 4894351 (1990-01-01), Balty

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Formation of self-aligned contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of self-aligned contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of self-aligned contacts will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1572503

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.