Coating apparatus – Gas or vapor deposition – With treating means
Reexamination Certificate
2005-02-17
2011-11-22
Zervigon, Rudy (Department: 1716)
Coating apparatus
Gas or vapor deposition
With treating means
C118S7230AN, C118S666000, C118S663000, C204S298010, C156S345430, C156S345440
Reexamination Certificate
active
08061299
ABSTRACT:
A deposition system includes a vacuum reaction chamber with a substrate holder positioned in it. The substrate holder is for carrying a substrate therein. A sputtering apparatus is also positioned in the vacuum reaction chamber. The sputtering apparatus is configured to direct sputtered material towards the substrate to form a sputtered material region thereon. A plasma enhanced chemical vapor deposition (PECVD) apparatus is positioned in the vacuum reaction chamber. The PECVD apparatus is configured to deposit a PECVD material region thereon the substrate. The first PECVD apparatus includes a first PECVD electrode movable from a first position towards the substrate and a second position away from the substrate.
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The von Hellens Law Firm, Ltd.
Zervigon Rudy
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