Radiation imagery chemistry: process – composition – or product th – Imaged product
Patent
1994-11-16
1996-03-05
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaged product
430 11, 430 12, 430 14, 430 15, 4284111, G03F 726
Patent
active
054966680
ABSTRACT:
In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.
REFERENCES:
patent: 3449221 (1969-06-01), Thomas
patent: 3535137 (1970-10-01), Haller et al.
patent: 3886584 (1975-05-01), Cook, Jr. et al.
patent: 3984582 (1976-10-01), Feder et al.
patent: 4035522 (1977-07-01), Hatzakis
patent: 4107351 (1978-08-01), James et al.
patent: 4108938 (1978-03-01), Feder et al.
patent: 4351653 (1982-09-01), Becker et al.
patent: 4422905 (1983-12-01), Becker et al.
patent: 4493753 (1985-01-01), Becker et al.
patent: 4541977 (1985-09-01), Becker et al.
patent: 4563250 (1986-01-01), Becker et al.
patent: 4563251 (1986-01-01), Becker et al.
patent: 4661212 (1987-04-01), Ehrfeld et al.
patent: 4693791 (1987-09-01), Becker et al.
patent: 4694548 (1987-09-01), Ehrfeld et al.
patent: 4698285 (1987-10-01), Ehrfeld et al.
patent: 4703559 (1987-11-01), Ehrfeld et al.
patent: 4705605 (1987-11-01), Becker et al.
patent: 4738010 (1988-04-01), Ehrfeld et al.
patent: 4780382 (1988-10-01), Stengl et al.
patent: 4784935 (1988-11-01), Ehrfeld et al.
patent: 4797211 (1989-01-01), Ehrfeld et al.
patent: 4872888 (1989-10-01), Ehrfeld et al.
patent: 5189777 (1993-03-01), Guckel et al.
patent: 5190637 (1993-03-01), Guckel
patent: 5206983 (1993-05-01), Guckel et al.
patent: 5327033 (1994-07-01), Guckel et al.
patent: 5357807 (1994-10-01), Guckel et al.
E. W. Becker, et al., "Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography Galvanoformin and Plastic Moulding (LIGA process)", Microelectronic Engineering, vol. 4, No. 1, May 1986, pp. 35-56.
W. Ehrfeld, et al., "Fabrication of Microstructures Using the LIGA Process" Proc. IEEE Micro Robots and Teleoperators Workshop, Nov. 9-11, 1987, pp. 1-11.
P. Hagmann, et al., "Fabrication of Microstructures of Extreme Structural Heights by Reaction Injection Moulding", International Polymer Processing IV, 1989, pp. 188-195.
W. Ehrfeld, et al., "Microfabrication of Sensors and Actuators for Microrobots," Proc. IEEE International Workshop on Intelligent Robots and Systems, Tokyo, Japan, Oct. 31-Nov. 2, 1988, pp. 3-7.
W. Ehrfeld, "Three Dimensional Microfabrication Using Synchrotron Radiation International Symposium on X-Ray Synchrotron Radiation and Advanced Science and Technology", Feb. 15-16, 1990, pp. 121-141.
W. Ehrfeld, et al., "LIGA Process: Sensor Construction Techniques Via X-Ray Lithography," Technical Digest, IEEE Solid State Sensor and Actuator Workshop 1988, pp. 1-4.
H. Guckel, et al., "Deep X-Ray and UV Lithographies for Micromechanics", Technical Digest, IEEE Solid State Sensor and Actuator Workshop, Hilton Head, South Carolina, Jun. 4-7, 1990, pp. 118-122.
H. Guckel, et al., "Mcorostructure sensors," International Electron Devices Meeting (IEDM), San Francisco, California, Dec. 1990.
H. Guckel, et al., "Fabrication of Assembled Micromechanical Components via Deep X-Ray Lithography", Proceedings of IEEE Micro Electro Mechanical Systems (MEMS) 1991, Nara, Japan, 30 Jan.-2 Feb. 1991.
W. Menz, et al., "The LIGA Technique--a Novel Concept for Microstructures and the Combination with Si-Technologies by Injection Moulding", Proceedings on IEEE Micro Electro Mechanical Systems (MEMS) 1991, Nara, Japan, 30 Jan.-2 Feb., 1991, pp. 691-73.
PiRL: Polyimide Release Layer, brochure from Brewer Science, Inc.
Roger T. Howe, et al., "Silicon Micromechanics: Sensors and Actuators on a Chip", IEEE Spectrum, Jul., 1990, pp. 29-35.
J. Mohr, et al., "Fabrication of Microsensor and Microactuator Elements by the LIGA-Process," Proceedings of Transducers'91, San Francisco, CA, Jun. 24-27, 1991, pp. 607-609.
H. Guckel, et al., "Fabrication and Testing of the Planar Magnetic Micromot Journal of Micromechanics and Microengineering", IOP Publishing, England, vol. 1, No. 3, Dec. 1991.
H. Guckel, "Silicon Microsensors: Construction, Design and Performance," European Solid State Conference, Montreux, Switzerland, Sep. 1991, pp. 387-398.
H. Guckel, "On The Application of Deep X-Ray Lithography and Metal Plating to Micromechanics and Micromagnetics," The Second International Symposium on MicroMachine and Human Science, Nagoya, Japan, Oct. 8 and 9, 1991.
H. Guckel, et al., "On the Application of Deep X-Ray Lithography With Sacrificial Layers to Sensor and Actuator Construction (the Magnetic Micromoto with Power Takeoffs)," Proceedings '91 of Transducers '91, San Francisco, CA, Jun. 24-27, 1991.
H. Guckel, et al., "Microactuator Production Via High Aspect Ratio, High Edge Acuity Metal Fabrication Technology," Microtechnologies and Applications to Space Systems Conference, JPL, Pasadena, California, May 27, 1992.
H. Guckel, et al., "Fabrication and Testing of Metal Micromechanisms With Rotational and Translational Motion, " SPIE Conf., Orlando, Florida, May, 1992.
H. Guckel, et al., "Deep X-Ray Lithography, Metal Plating and Assembly As Fabrication Tools for Micromechanics," 11th Sensor Symposium, Japan IEE, Tokyo Japan, Jun., 1992.
H. Guckel, et al., "Metal Micromechanisms Via Deep X-Ray Lithography, Electroplating and Assembly," Actuators '92, Bremen, Germany, Jun. 22, 1992.
H. Guckel, "Micromechanics" A Multifacted Technology for New and Improved Products, Interkama Conference, Germany, Oct., 1992.
Andreas Stutz, "Untersuchungen Zum Entwicklungsverhalten eines Rontgenresists aus Vernetztem Polyethylmethacrylat," Diplomarbeit, Institut fur Kernverfahrenstechnik des Kernforschungszentrums Karlsruhe und der Universitat Karlsruhe, 1986, p. 6 (in German), with English translation of Sec. 2.1, first para., p. 6 English translation considered.
"Multilayer Circuit Fabrication Using Double Exposure of Positive Resist," IBM Technical Disclosure Bulletin, vol. 36, No. 10, Oct. 1993.
Christenson Todd R.
Guckel Henry
Skrobis Kenneth
Duda Kathleen
Wisconsin Alumni Research Foundation
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