Formation of laminated structures by selective dielectric heatin

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428331, 428337, 428340, 428408, 428419, 428432, 428450, 428451, 428448, 428469, 427140, 427 451, 1562722, B32B 1500, B32B 3100, B05D 302

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047074027

ABSTRACT:
Multiple materials are bonded together by means of an RF-sensitized bonding film or sheet, wherein the RF-sensitized bonding film or sheet is inserted at an intermediate position adjacent to the multiple materials to be bonded, and exposed to a dielectric field for such period of time so as to effect fusion or sintering of the RF-sensitized bonding film or sheet to the multiple materials so as to bond the multiple materials together and form a laminated structure.

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patent: 3894983 (1978-07-01), Higbee
patent: 3979543 (1976-09-01), Higbee
patent: 4157273 (1979-06-01), Brady
patent: 4212922 (1980-07-01), Tieszen
patent: 4212923 (1980-07-01), Brady
patent: 4352707 (1982-10-01), Wenglar et al.
patent: 4522875 (1985-06-01), Still, Jr. et al.

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