Formation of high quality patterns for substrates and apparatus

Boots – shoes – and leggings

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

36447402, 2191217, 2191218, C06F 1546, B23K 2600

Patent

active

051684543

ABSTRACT:
An apparatus and method for accurately and rapidly machining a workpiece, particularly for drilling holes smaller than can be formed by other methods, by using a high power pulsed Nd:YAG laser. A low power HeNe laser is joined to the optical path of the high power laser. The colinear beams then scan along one axis of the workpiece. The low power beam is partially split off to a location determining device before final deflection to the workpiece. Deflection in a second axis is achieved by linearly moving the workpiece so that the beam will impinge upon the desired location of the workpiece.

REFERENCES:
patent: 3696504 (1972-10-01), Cupler, II
patent: 3730039 (1973-05-01), Fedrigo
patent: 3757125 (1973-09-01), Okada et al.
patent: 3867560 (1989-09-01), Kunitsugu
patent: 3902036 (1975-08-01), Zaleckas
patent: 4115683 (1978-09-01), Clark et al.
patent: 4201905 (1980-05-01), Clark et al.
patent: 4319839 (1982-03-01), Durvan
patent: 4425829 (1984-01-01), Kranik et al.
patent: 4520816 (1985-06-01), Schachar
patent: 4544442 (1985-10-01), Lassen
patent: 4555798 (1985-11-01), Broadbent et al.
patent: 4724298 (1988-02-01), Hawkins et al.
patent: 4789770 (1988-12-01), Kasner et al.
patent: 4808000 (1989-02-01), Pasciak
patent: 4821614 (1989-04-01), Fleet et al.
patent: 4884889 (1989-12-01), Beckwith, Jr.
patent: 4956546 (1990-09-01), Nishibe et al.
IBM TDB, vol. 13, No. 9, Feb., 1971, p. 2536, "Multiple Via Punch", C. J. Lucas, et al.
IBM TDB, vol. 16, No. 12, May 1974, pp. 3933-3934, "Air Spring" Programmable via Punching Head, J. R. Kranik, et al.
IBM TDB, vol. 20, No. 4, Sep. 1977, pp. 1379-1380, "Automated Punch Apparatus for Forming via Holes in a Ceramic Green Sheet", T. J. Cochran and R. G. Haas.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Formation of high quality patterns for substrates and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of high quality patterns for substrates and apparatus , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of high quality patterns for substrates and apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-507092

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.