Formation of gate electrode

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

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438439, 438452, 438592, H01L 2176

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active

061331155

ABSTRACT:
The invention relates to an improvement in formation of a gate electrode. In the invention, there are formed first and second oxides on a surface of a substrate. The second oxides have a top surface higher by a height H than top surfaces of the first oxides. A gate electrode composed of a polysilicon film and a silicide film deposited on the polysilicon film is formed so that the polysilicon film is planarized at a level higher than top surfaces of the first oxides but lower than top surfaces of the second oxides. The invention prevents excessive etching of the polysilicon film without fabrication steps being increased, and thus makes it possible to form a gate electrode having a dimension defined by a mask.

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Y. Kawamoto et al., "A Half Micron Technology for an Experimental 16 Mbit DRAM Using i-Line Stepper," '88 VL Symp., pp. 17-18.

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