Formation of copper electrode on ceramic oxide

Details Formation of copper electrode on ceramic oxide Formation of copper electrode on ceramic oxide

1986-03-17

1988-05-31

Niebling, John F.

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Of quartz or glass

204 371, 204 384, 427123, 427124, 4273835, 428469, C25D 550, C25D 554

Patent

active

047480866

ABSTRACT:
A copper electrode is firmly bonded to a sintered ceramic oxide body by applying a first copper film on a ceramic oxide body by electroless plating or vapor phase plating such as evaporation or sputtering, forming a second copper film thereon by electrolytic plating, and heat treating the copper films on the body at a temperature of 750.degree. to 1065.degree. C. in a weakly oxidizing atmosphere.

REFERENCES:
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4259409 (1981-03-01), Arnold
patent: 4281041 (1981-07-01), Koehler
patent: 4342632 (1982-08-01), Heim et al.
patent: 4428986 (1984-01-01), Schachameyer
patent: 4569902 (1986-02-01), Saito
patent: 4647477 (1987-03-01), DeLuca
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 416-418.

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