Formation of copper electrode on aluminum nitride

Details Formation of copper electrode on aluminum nitride Formation of copper electrode on aluminum nitride

1986-02-20

1988-04-12

Niebling, John F.

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204 371, 204 384, 427 96, 427 98, 427123, 427124, 4273833, B05D 302

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047374160

ABSTRACT:
A copper electrode is firmly bonded to a sintered aluminum nitride body by applying a copper film on a sintered aluminum nitride body by electroless or electrolytic plating, evaporation or sputtering, and heat treating the copper film on the body at a temperature of 900.degree. to 1083.degree. C. in a weakly oxidizing atmosphere.

REFERENCES:
patent: 4259409 (1981-03-01), Arnold
patent: 4281041 (1981-07-01), Koehler
patent: 4342632 (1982-08-01), Heim et al.
patent: 4428986 (1984-01-01), Schachameyer
patent: 4569902 (1986-02-01), Saito
patent: 4647477 (1987-03-01), DeLuca
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 59-60.
J. L. Vossen et al, Thin Film Processes, Academic Press, New York, 1978, pp. 14-18, 210-212.

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