Formation of conductive rugged silicon

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438255, 438565, 438964, 427 99, 427255393, 4272557, 4273977, C23C 1624

Patent

active

060690534

ABSTRACT:
The present invention provides methods of forming in situ doped rugged silicon and semiconductor devices incorporating conductive rugged silicon. In one aspect, the methods involve forming a layer of doped amorphous silicon on a substrate at a substantially constant deposition temperature; and converting the amorphous silicon layer into hemispherical grain silicon by annealing the amorphous silicon layer at substantially the deposition temperature while varying pressure. In another aspect, the methods involve forming a discontinuous first layer of doped silicon on a substrate; forming a second layer of amorphous silicon on the first layer of doped silicon and the substrate not covered by the first layer of doped silicon; and annealing the first and second layers. In yet another aspect, the methods involve forming a discontinuous first layer of silicon on a substrate and forming a second conformal layer of doped amorphous silicon on the first layer of doped silicon.

REFERENCES:
patent: 4904611 (1990-02-01), Chiang et al.
patent: 5149676 (1992-09-01), Kim et al.
patent: 5202278 (1993-04-01), Mathews et al.
patent: 5208479 (1993-05-01), Mathews et al.
patent: 5242507 (1993-09-01), Iverson
patent: 5242855 (1993-09-01), Oguro
patent: 5266514 (1993-11-01), Tuan et al.
patent: 5278091 (1994-01-01), Fazan et al.
patent: 5318920 (1994-06-01), Hayashide
patent: 5324679 (1994-06-01), Kim et al.
patent: 5366917 (1994-11-01), Watanabe et al.
patent: 5407534 (1995-04-01), Thakur
patent: 5418180 (1995-05-01), Brown
patent: 5444013 (1995-08-01), Akram et al.
patent: 5550070 (1996-08-01), Funai et al.
patent: 5573968 (1996-11-01), Park
patent: 5583070 (1996-12-01), Liao et al.
patent: 5700710 (1997-12-01), Zenke
patent: 5770500 (1998-06-01), Batra et al.
H. Watanabe et al., "Device application and structure observation for hemispherical-grained Si", J. App. Phys., 71, 3538-3543 (1992). (no month).
H. Watanabe et al., "Hemispherical Grained Silicon (HSG-Si) Formation on In-Situ Phosphorous Doped Amorphous-Si Using The Seeding Method", Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials, 422-424 (1992). (no month).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Formation of conductive rugged silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of conductive rugged silicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of conductive rugged silicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1909659

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.