Formation of catalytic metal nuclei for electroless plating

Details Formation of catalytic metal nuclei for electroless plating Formation of catalytic metal nuclei for electroless plating

1988-03-22

1989-05-16

Morgenstern, Norman

Coating processes

Heat decomposition of applied coating or base material

Coating decomposed to form metal

427 97, 427 98, 427306, 4274431, B05D 304, B05D 512

Patent

active

048308803

ABSTRACT:
An electroless plating method which comprises applying to a substrate a polymer composition comprising 100 parts by weight of a polymer and an organic metal complex in an amount of from 0.001 to 50 parts by weight as metal, pyrolytically decomposing the organic metal complex at a temperature of from 50.degree. to 500.degree. C. to form plating catalyst metal nuclei on the substrate, removing the dried polymer coating, and conducting electroless plating of the substrate.

REFERENCES:
patent: 3523824 (1970-08-01), Powers et al.
patent: 3900320 (1975-08-01), Rolker et al.
patent: 3937857 (1976-02-01), Brumett
patent: 4317856 (1982-03-01), Huthwelker
patent: 4368281 (1983-01-01), Brumett
patent: 4493861 (1985-01-01), Sirinyan
patent: 4585502 (1986-04-01), Uozu
patent: 4622069 (1986-11-01), Akai
patent: 4663240 (1987-05-01), Hajdu
patent: 4716050 (1987-12-01), Green et al.
patent: 4717587 (1988-01-01), Suhr et al.
patent: 4719145 (1988-01-01), Neely
patent: 4764401 (1988-08-01), Sirinyan et al.
IBM Technical Disclosure Bulletin, vol. 11, No. 8, Jan. 1969, p. 1001, Bailey et al: "Catalysis for electroless copper plating".

Affiliated with

Also associated with

Rating

Formation of catalytic metal nuclei for electroless plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formation of catalytic metal nuclei for electroless plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formation of catalytic metal nuclei for electroless plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2321424