Formation of an electrode pattern

Details Formation of an electrode pattern Formation of an electrode pattern

1979-10-03

1982-04-27

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 38S, 427108, 427109, 427266, C25D 1102, B05D 500, B05D 512

Patent

active

043269290

ABSTRACT:
A method is disclosed for forming an electrode pattern which is free of erosion, separation of a wiring pattern from a substrate, etc., through the use of a lift-up method, which comprises the steps of: etching a transparent, electrically conductive film deposited on a major surface of the substrate for the formation of the transparent electrode pattern; overlaying the whole of the major surface of the substrate with a layer of photoresist; removing a portion of said photoresist layer in the metal electrode pattern; coating substantially the entire major surface of the substrate with a layer of metal electrode material; and removing the remaining photoresist layer with the aid of a resist remover thereby forming the metal electrode pattern.

REFERENCES:
patent: 3351825 (1967-11-01), Vidas
patent: 3498833 (1970-03-01), Lehrer
patent: 3814501 (1974-06-01), Schindler
patent: 3928658 (1975-12-01), Van Boxtel
patent: 3991227 (1976-11-01), Carlson
patent: 4076575 (1978-02-01), Chang
patent: 4187340 (1980-02-01), Oishi

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