Formation method of metal layer on resin layer, printed...

Details Formation method of metal layer on resin layer, printed... Formation method of metal layer on resin layer, printed...

2004-11-15

2009-11-10

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S612000, C428S901000, C174S258000, C174S259000

Reexamination Certificate

active

07615277

ABSTRACT:
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

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