Formation method of metal layer on resin layer, printed...

Details Formation method of metal layer on resin layer, printed... Formation method of metal layer on resin layer, printed...

2011-06-21

2011-06-21

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Microscopic interfacial wave or roughness

C428S209000, C428S615000, C428S617000, C428S618000, C428S621000

Reexamination Certificate

active

07964289

ABSTRACT:
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

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