Formation method of metal layer on resin layer

Details Formation method of metal layer on resin layer Formation method of metal layer on resin layer

2007-08-10

2010-10-26

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C029S840000, C029S846000

Reexamination Certificate

active

07818877

ABSTRACT:
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

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