Formation method of electroconductive pattern, and...

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead

Reexamination Certificate

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C438S029000, C438S674000, C257SE21295

Reexamination Certificate

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07314768

ABSTRACT:
In regard to an electroconductive pattern including a high resistivity region partially, by forming a pattern with a photosensitive resin, making the pattern absorb liquid containing a metal component, and baking this, an electroconductive film of metal oxide is formed, this electroconductive film is further covered by a gas shielding layer, and portions which are not shielded are reduced selectively to be made low resistance metal film regions. Since the material which constitutes the electroconductive pattern is hardly removed, a load concerning material reuse is mitigated and material cost is reduced.

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patent: 2005/0266589 (2005-12-01), Furuse et al.
patent: 2006/0045961 (2006-03-01), Furuse et al.
patent: 2006/0057279 (2006-03-01), Terada et al.
patent: 5-114504 (1993-05-01), None

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