Formaldehyde-free electroless copper plating solutions

Details Formaldehyde-free electroless copper plating solutions Formaldehyde-free electroless copper plating solutions

1989-02-23

1989-10-31

Morris, Theodore

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C23C 302, C23C 1600

Patent

active

048774502

ABSTRACT:
This invention relates to a formaldehyde-free electroless copper plating solution, containing a solution soluble divalent copper compound in a concentration between about 1/2 and 2 g/l; a reducing agent for the copper compound in an amount of between about 1 and 3 g/l; a complexing and chelating agent mixture of between about 5 and 100 ml/l of an alkanol amine having at least one alkyl group with one to three carbon atoms and between about 1 and 10 g/l of an ethylene diamine compound of the formula ##STR1## wherein R is an alkyl moiety having between 1 and 3 carbon atoms and X is --OH or --COOH; the solution preferably having a pH between about 7 and 8.5 and a temperature preferably between about 130.degree. and 150.degree. F., with the complexing and chelating agent mixture being present to provide stability to the solution and to enable the solution to provide a uniform plating rate of copper upon a substrate which is immersed therein.

REFERENCES:
patent: 3431120 (1969-03-01), Weisenberger
patent: 3870526 (1975-03-01), Pearlstein et al.
patent: 4138267 (1969-02-01), Arisato et al.
patent: 4143186 (1979-03-01), Davis
patent: 4617205 (1986-10-01), Darken
patent: 4684550 (1987-04-01), Milius et al.

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