Formaldehyde-free autocatalytic electroless copper plating

Details Formaldehyde-free autocatalytic electroless copper plating Formaldehyde-free autocatalytic electroless copper plating

1985-12-17

1986-10-14

Hayes, Lorenzo B.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 123, 106 126, 427437, 4274431, 428936, C23C 302

Patent

active

046172050

ABSTRACT:
Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.

REFERENCES:
patent: 4209331 (1980-06-01), Kukanskis et al.

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