Wireworking – Crimping
Patent
1996-01-24
1997-10-07
Larson, Lowell A.
Wireworking
Crimping
72462, B21D 3701
Patent
active
056737300
ABSTRACT:
An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.
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Larson Lowell A.
Micro)n Technology, Inc.
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