Form tooling and method of forming semiconductor package leads

Wireworking – Crimping

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72462, B21D 3701

Patent

active

056737300

ABSTRACT:
An improved forming tool for forming at least one lead of a semiconductor package includes a member having at least one surface. The at least one surface of the member has a first shape for forming the at least one lead of the semiconductor package to a shape corresponding to the first shape. The at least one surface includes a diamond-like carbon coating thereon. The semiconductor package lead forming method in accordance with the present invention includes providing a semiconductor package having at least one lead in a first shape. A diamond-like carbon coated surface is applied to the at least one lead in the first shape to form the at least one lead into a second shape.

REFERENCES:
patent: 4553420 (1985-11-01), Fierkens et al.
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5387447 (1995-02-01), Slutz et al.
"Low-Pressure/High Pressure & Temperature Synthesis Diamond, Diamond-Like, and Related Materials Applications, Markets, and Funding Issues Worldwide," Diamond Depositions, Science and Technology, vol. 1, No. 2, Nov. (1990), pp.27-31.
Kimock et al., "Diamond-Like Carbon (DLC) Coating: Its Application for Polymeric Substrates," Materials Research Society, 1992, pp. 1-7.
Kimock et al., "Commercial Applications of Ion Beam Deposited Diamond-Like Carbon (DLC) Coatings," Surface and Coatings Technology, vol. 56, (1993) pp. 273-279.
Knapp et al., "Abrasion-Resistant Diamond-Like Carbon (DLC) Films for Optical Applications," Presented at the 35th Annual Society of Vacuum Coaters Technical Conference, Baltimore, Maryland, (1992), pp. 1-8.
Shing, "Films Composed of Diamond and Diamond-Like Carbon," NASA Tech Brief, Apr. (1995), vol. 19, No. 4, Item #51, pp. i, 1-2.
Pinneo, "Recent Articles," Diamond Depositions: Science and Technology, Nov. (1990), p. 17.
Tsai et al., "Characterization of diamondlike carbon films and their application as overcoats on thin-film media for magnetic recording," J. Vac. Sci. Technol. A5, 6, Nov./Dec. (1987), pp.3287-3312.
Anatech LTD, "Casidiam, Diamond-Like Carbon Coating" Product Literature, Non-dated.

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