Forced vaporization heat sink for semiconductor devices

Details Forced vaporization heat sink for semiconductor devices Forced vaporization heat sink for semiconductor devices

1979-05-11

1981-05-19

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 16HS, 165 80C, 357 79, H01L 2504, H01L 2342, H01L 2344

Patent

active

042688507

ABSTRACT:
A fluid cooled heat sink is provided for use in cooling high power semiconductor devices. The heat sink includes a body formed of thermally conductive material having internal fluid passageways. Cooling fluid from an external source is passed through the heat sink. The preferred heat sink includes a pair of manifolds and means cooperating with the manifolds to allow selective interconnection of the interior passageways of the heat sink.

REFERENCES:
patent: 2917685 (1959-12-01), Wiegand
patent: 3013191 (1961-12-01), Connell
patent: 3652903 (1972-03-01), Eriksson et al.
patent: 3918084 (1975-11-01), Schierz
patent: 4051509 (1977-09-01), Beriger et al.
patent: 4079410 (1978-03-01), Schierz
patent: 4138692 (1979-02-01), Meeker et al.

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