Forced-flow wafer polisher

Details Forced-flow wafer polisher Forced-flow wafer polisher

1994-08-02

1998-07-21

Dang, Thi

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

438745, H01L 2100

Patent

active

057834970

ABSTRACT:
A forced-flow polishing technique forcibly flows slurry across the surface of a wafer. The slurry and the wafer are contained in a confined space so that the slurry flow is between a fixed upper and lower boundaries. The slurry flow places selective stress on wafer features such that taller surfaces are eroded at a faster rate. The constant flow allows for uniformity in achieving the selective erosion across the wafer surface.

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