Forced-convection, liquid-cooled, microchannel heat sinks

Details Forced-convection, liquid-cooled, microchannel heat sinks Forced-convection, liquid-cooled, microchannel heat sinks

1988-03-09

1990-01-16

Mintel, William A.

357 55, 357 81, H01L 2504

Patent

active

048947091

ABSTRACT:
A microchannel heat sink used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow. The turbulent flow may be either developing or fully developed. The heat sink features a compensation heater surrounding the integrated circuit and heated at the same rate as the integrated circuit to thereby provide a more uniform temperature at the perimeter of the integrated circuit.

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