Heat exchange – With impeller or conveyor moving exchange material – Mechanical gas pump
Patent
1997-08-04
1998-08-18
Flanigan, Allen J.
Heat exchange
With impeller or conveyor moving exchange material
Mechanical gas pump
165 803, 361697, 415 90, H05K 720
Patent
active
057946876
ABSTRACT:
An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.
REFERENCES:
patent: 5000254 (1991-03-01), Williams
patent: 5297617 (1994-03-01), Herbert
patent: 5309983 (1994-05-01), Bailey
patent: 5335143 (1994-08-01), Maling, Jr. et al.
patent: 5419679 (1995-05-01), Gaunt et al.
patent: 5445215 (1995-08-01), Herbert
patent: 5566749 (1996-10-01), Jordan et al.
patent: 5583746 (1996-12-01), Wang
patent: 5597034 (1997-01-01), Barker, III et al.
patent: 5629834 (1997-05-01), Kodama et al.
Kamath Vinod
Mansuria Mohanlal S.
Mok Lawrence Shungwei
Webster, Jr. Leo H.
Flanigan Allen J.
Grosser George E.
International Business Machine Corp.
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