Folded interposer

Details Folded interposer Folded interposer

2006-01-03

2006-01-03

Duong, Hung V. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S789000, C174S260000, C257S782000

Reexamination Certificate

active

06982869

ABSTRACT:
A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through electrical contacts on the interposer. The folded interposer allows multiple semiconductor dice to be efficiently stacked in a high density semiconductor package by reducing the unused or wasted space between stacked semiconductor dice. Vias extending through the folded interposer provide electrical communication between the semiconductor dice and the substrate. The present invention also relates to a method of packaging semiconductor dice in a high density arrangement and a method of forming the high density semiconductor package.

REFERENCES:
patent: 4851613 (1989-07-01), Jacques
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5585675 (1996-12-01), Knopf
patent: 5600183 (1997-02-01), Gates, Jr.
patent: 5604377 (1997-02-01), Palagonia
patent: 5682061 (1997-10-01), Khandros et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5889652 (1999-03-01), Turturro
patent: 5900738 (1999-05-01), Khandros et al.
patent: 5994166 (1999-11-01), Akram et al.
patent: 6002590 (1999-12-01), Farnworth et al.
patent: 6014320 (2000-01-01), Mahon et al.
patent: 6020749 (2000-02-01), Morris et al.
patent: 6097611 (2000-08-01), Samaras et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6225688 (2001-05-01), Kim et al.
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6444921 (2002-09-01), Wang et al.
patent: 6473308 (2002-10-01), Forthun
patent: 6699730 (2004-03-01), Kim et al.
patent: 2003/0062614 (2003-04-01), Larson
patent: 2004/0042190 (2004-03-01), Eng et al.

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