Folded conducting member heatsinks and method of making same

Details Folded conducting member heatsinks and method of making same Folded conducting member heatsinks and method of making same

1995-12-15

1998-06-30

Flanigan, Allen J.

Heat exchange

Heat transmitter

361704, H05K 720

Patent

active

057719667

ABSTRACT:
A folded heat conducting member heatsink includes a base portion and a folded heat conducting member secured into engagement with the base portion with one or more folded heat conducting member securing element, such as annealed metal inserts. The folded heat conducting member includes at least first and second heat conducting portions, such as fins, extending from a fold portion engaged with one or more grooves in the base portion. The securing element or insert is swaged or deformed to force the heat conducting portions into engagement with the groove of the base portion. The method of making the heat sink includes: inserting one or more securing elements, between the heat conducting portions; inserting the heat conducting portions into the groove of the base portion; and applying pressure to the securing elements, such as with an impacting die, to swage or deform the securing elements. The base portion and heat conducting portions of the folded heat conducting member are made of a heat conductive material. The securing elements are made of a similar heat conductive material in an annealed form so that the securing elements can be deformed to fit the shape of the groove and secure the fin portions of the folded heat conducting member into engagement with the groove of the base portion.

REFERENCES:
patent: 1830375 (1931-11-01), Shoop
patent: 4095253 (1978-06-01), Yoshimura et al.
patent: 4544942 (1985-10-01), McCarthy
patent: 5406698 (1995-04-01), Lipinski
J.B. Randolph, "Transistor Heat Sink" IBM Tech. Disclosure Bulletin vol. 14 No. 5 pp. 1489-1490, Oct. 1971.

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