Foldable electronic assembly module

Details Foldable electronic assembly module Foldable electronic assembly module

1992-02-10

1993-06-29

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

174254, 361398, 361413, 439 67, H05R 111

Patent

active

052240231

ABSTRACT:
An electronic assembly combines a number of commensurate printed circuit boards bonded to a common, flexible, interconnecting substrate in an alternately folded and layered arrangement against an end board that has a comb of terminals for mounting into a motherboard connector. The flexible substrate is sandwiched between half-sections of each board, allowing mounting of components from both faces of the board. The assembly is particularly indicated for high density applications such as memory modules.

REFERENCES:
patent: 3242384 (1966-03-01), Klehm, Jr.
patent: 3766439 (1973-10-01), Isaacson
patent: 3873889 (1975-03-01), Leyba
patent: 4338149 (1982-07-01), Quaschner
patent: 4495546 (1985-01-01), Nakamura et al.
patent: 4509095 (1985-04-01), Boros
patent: 4567543 (1986-01-01), Miniet
patent: 4781601 (1988-11-01), Kuhl et al.
patent: 4928206 (1990-05-01), Porter et al.
patent: 5095628 (1992-03-01), McKenney et al.
IBM Disclosure Bulletin "Module Test Socket" by Kam vol. 22 No. 8A Jan. 1980.

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