Foldable circuit assembly

Geometrical instruments

Patent

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Details

H01R 2368

Patent

active

044602243

ABSTRACT:
Disclosed is a foldable circuit assembly 10 which has eight support members 11 having windows 12 in which circuits are bonded. The support members are all interconnected by a flexible polyimide web and an electrical circuit is etched thereon so as to interconnect the circuits and the external world via a contact tab extending from one of the support wafer members 11.

REFERENCES:
patent: 3242384 (1966-03-01), Klehm, Jr.
patent: 3755717 (1973-08-01), Shaw
patent: 3971127 (1976-07-01), Giguere et al.
patent: 3984739 (1976-10-01), Mochizuki et al.
IBM Bulletin, Thorpe et al., vol. 13, No. 10, p. 3708, 5-1971.
Electronics, Microminiaturization, 11-1960, pp. 78-80.
Electronic Design, 3M Advertisement, 8-1962, p. 132.

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