Foil-form soldering metal and method for processing the same

Details Foil-form soldering metal and method for processing the same Foil-form soldering metal and method for processing the same

2006-05-23

2006-05-23

Sheehan, John P. (Department: 1742)

Metal treatment

Stock

Containing over 50 per cent metal, but no base metal

C148S430000, C148S559000, C148S678000, C148S707000, C420S507000, C420S557000, C420S589000, C228S262210

Reexamination Certificate

active

07048813

ABSTRACT:
The present invention provides a processing method capable of continuously working an Au—Sn soldering metal having a foil form in room temperature. The foil-form soldering metal containing from 10% by weight to 90% by weight of Au and balance comprising Sn is subjected to heat treatment for five minutes to ten hours at 200° C. to 270° C., and subsequently the foil-form soldering metal is slit. Thus, the heat treatment of the Au—Sn soldering metal before slitting enables continuous slitting of the Au—Sn foil-form soldering metal in room temperature and facilitates the production of a ribbon-form soldering metal.

REFERENCES:
patent: 5095359 (1992-03-01), Tanaka et al.
patent: 6700913 (2004-03-01), Pinneo et al.
patent: 6-234001 (1994-08-01), None
The American Heritage Dictionary of the American Language, 1976, pp. 756-757.

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