Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1983-05-25
1984-01-31
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204192R, C23C 1500
Patent
active
044288166
ABSTRACT:
A cathode assembly for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments which are formed substantially of a material which is desired to be sputter-deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respect to the plane of the substrate. Such inclination permits the material which is removed from the target bars to be focused onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. End target segments are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined, and connect with the elongated target segments to form a rectangular frame arrangement. An elongated inner pole piece has outwardly extending portions near each end to improve uniformity of a trapping magnetic field between the inner pole piece and a rectangular annular outer pole piece.
REFERENCES:
patent: 3878085 (1975-04-01), Corbani
patent: 4162954 (1979-07-01), Morrison
patent: 4169031 (1979-09-01), Brors
patent: 4265729 (1981-05-01), Morrison
patent: 4282083 (1981-08-01), Kertesz et al.
patent: 4312731 (1982-01-01), Morrison
Class Walter H.
Hieronymi Robert G.
Hurwitt Steven D.
Demers Arthur P.
Materials Research Corporation
LandOfFree
Focusing magnetron sputtering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Focusing magnetron sputtering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Focusing magnetron sputtering apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2344595