Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1981-10-29
1984-09-18
Kaplan, G. L.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204192R, C23C 1500
Patent
active
044722591
ABSTRACT:
A cathode assembly for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments which are formed substantially of a material which is desired to be sputter-deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respect to the plane of the substrate. Such inclination permits the material which is removed from the target bars to be focused onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. In other embodiments, end target segments are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined, and connect with the elongated target segments to form a rectangular frame arrangement.
REFERENCES:
patent: 2146025 (1939-02-01), Penning
patent: 3562142 (1971-02-01), Lamont, Jr.
patent: 3878085 (1975-04-01), Corbani
patent: 4041353 (1977-08-01), Penfold et al.
patent: 4060470 (1977-11-01), Clarke
patent: 4198283 (1980-04-01), Class et al.
John L. Vossen et al., Thin Film Processes, Academic Press, New York, 1978, pp. 115-117, 126-128.
Aronson Arnold J.
Class Walter H.
Hill Michael L.
Hurwitt Steven D.
Kaplan G. L.
Leader William T.
Materials Research Corporation
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