Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2001-08-03
2003-05-27
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S022000, C438S027000, C438S106000, C438S121000, C438S123000
Reexamination Certificate
active
06569698
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to surface mount optoelectric semiconductor device package, particularly to a package with a focusing cup.
(2) Brief Description of the Related Art
In many optoelectric semiconductor packages, a focusing cup is used to focus the emitted light. The prior art structure and fabrication steps are shown in
FIGS. 1-5
.
FIG. 1
shows two metal plates
111
,
112
with through holes
121
,
122
.
FIG. 2
shows a focusing cup
13
mounted over the two metal plates
111
,
112
. The metal plates
111
,
112
are supported on an insulating substrate
14
. The cup
13
has a reflecting wall
131
and is made of the same insulating glue as the substrate
14
. The glue feeds through the through holes
121
,
122
to attach the cup
13
to the substrate
14
with the metal plates
111
,
112
sandwiched in between. The inner ends of these plates form the bottom of the focusing cup and serve to contact the electrodes of a diode (not shown). The substrate
14
has two grooves
141
,
142
at the bottom corners of the substrate
14
.
FIG. 3
shows the folding of the outside ends of the two metal plates
111
,
112
at the edges of the substrate
14
to form two bottom contacts
151
,
152
for surface mounting the diode package to a motherboard.
FIG. 4
shows a transparent 3-dimensional view of the diode package. This figure shows how the end of the metal plate
111
is folded to provide a bottom contact
151
for surface mounting, and how the end of the metal plate
112
is folded to provide a bottom contact
152
for surface mounting.
FIG. 5
shows the bottom view of the structure with bottom contacts
151
,
152
.
The foregoing structure needs a thick substrate
14
for attaching the focusing cup
13
through holes
121
,
122
in the metal plates
111
,
112
to withstand the folding stress of the metal plates. The thick substrate
14
increases the height of the package and the cost. The through holes make it necessary for the bottom contacts to be wider than the through holes.
SUMMARY OF THE INVENTION
An object of the present invention is to reduce the height of a diode package with a focusing cup. Another object of this invention is to reduce the width of the package. Still another object of the present invention is to reduce the cost of such a package.
These objects are achieved by using preformed folded frames without using through holes. The focusing cup is directly glued to at least two folded metallic frames. Parts of the top surfaces of the folded metallic frame contacts the electrodes of a semiconductor device placed inside the cup. The bottoms of the metallic frames serve as the bottom contacts for surface mounting to a motherboard. The preformed metallic frames eliminate the folding stress in the prior art, and therefore can be made thinner than prior art. The elimination of the through holes can reduce the width of the package.
REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 6365922 (2002-04-01), Chang
Chang Bill
Hwang Chin-Mau James
Wang Bily
Harvatek Corp.
Lin H. C.
Pham Long
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