Focused convection reflow soldering method and apparatus

Details Focused convection reflow soldering method and apparatus Focused convection reflow soldering method and apparatus

1987-02-20

1988-09-20

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281802, 228230, 228232, 228 9, 219 85BA, 219 85BM, 219 85E, B23K 120, B23K 3102

Patent

active

047719290

ABSTRACT:
An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air heating to achieve solder reflow at throughput speeds and soldering quality not heretofore achievable.

REFERENCES:
patent: 3386166 (1968-06-01), Tardoskegyi
patent: 3604611 (1971-09-01), Lamberty
patent: 3769675 (1973-11-01), Chartet
patent: 4140266 (1979-02-01), Wagner
patent: 4600137 (1986-07-01), Comerford
patent: 4606493 (1986-08-01), Christoph et al.
patent: 4654502 (1987-03-01), Furtek

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