Foamed polymer for use as dielectric material

Details Foamed polymer for use as dielectric material Foamed polymer for use as dielectric material

1993-03-11

1998-07-07

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521134, 521184, 521189, C08J 902

Patent

active

057769907

ABSTRACT:
The present invention relates to an insulating foamed polymer having a pore size less than about 1000 .ANG. made from a copolymer comprising a matrix polymer and a thermally decomposable polymer by heating the copolymer above the decomposition temperature of the decomposable polymer.

REFERENCES:
patent: 2915483 (1959-12-01), Barnhart
patent: 3054761 (1962-09-01), Moore et al.
patent: 3213043 (1965-10-01), Kehr
patent: 3224983 (1965-12-01), D'Alelio
patent: 3547839 (1970-12-01), Tocker
patent: 3883452 (1975-05-01), Scheuerlein et al.
patent: 3917761 (1975-11-01), Scheuerlein et al.
patent: 4159251 (1979-06-01), Wrasidlo et al.
patent: 4661526 (1987-04-01), Ford
patent: 4732586 (1988-03-01), Dick et al.
patent: 4940733 (1990-07-01), Kuphal et al.
patent: 4980389 (1990-12-01), Hill et al.
Patel et al., "Microporosity in Thin Polymer Films", presented at 34th International SAMPE Symposium, May 8-11, 1989 in Reno, Nevada.
Patel et al., "The Cure of Epoxy and Poly(propylene Oxide) Modified Epoxy Systems via Dynamic Mechanical Analysis and Thermogravimetric Analysis", presented at the Proced. 18th N. Amer. Thermal Analysis Conf., 1989, 231-239.
Jackson et al., "The Linear Elastic Properties of Microcellular Foams", Polymer, 1991 vol. 32, No. 2.

Affiliated with

Also associated with

Rating

Foamed polymer for use as dielectric material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Foamed polymer for use as dielectric material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Foamed polymer for use as dielectric material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1206619